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  • AWS1線切割機
    The AWS1 Abrasive Wire Saw allows fragile or diffi cult materials to be cut or wafered without fear of the samples being damaged. Designed for use in photonics, semiconductor, opto-electronics
    01

    更新日期

    2025-12-05
    02

    瀏覽量

    6005
  • APD1 外延切割機
    The APD1 is a combined annular and precision saw ideal for slicing wafers, crystals or semiconductor components up to 55mm in diameter. It is also suitable for precision dicing of wafers up to 100mm
    01

    更新日期

    2025-12-05
    02

    瀏覽量

    3216
  • GTS 金剛石切割機
    The GTS1 Thin Section Cut-off and Trim Saw is ideal for geological application areas - cutting hard or soft rocks, concretes or cements with equally high effi ciency.
    01

    更新日期

    2026-05-14
    02

    瀏覽量

    3203
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